1.
a\. in hardware :
Reducing atmosphere kiln setup and released.
2.
b\. in process :
Optimize process condition in both atmosphere and temperature.
:
Thin ceramic foil casting and high precision stacking technology.
3.
c\. in material :
Dielectric powder and metal paste optimization to match in between.
4.
d\. in application :
High capacitance 1uF~22uF MLCC mass production, to replace Tantalum
capacitors.
5.
a\. To be one of the global BME High capacitance MLCC
technical leaders.
6.
b\. To be the major and total solution supplier of
communication components by applying BME technology and material.
7.
c\. To achieve more efficiency productivity by
integrated overall production equipment as automatically.
Core Technology |
What for |
R&D Central in WTC |
|
Japan |
Taiwan |
||
Dielectric material development |
. Better Yield .
High capacitance MLCC |
O |
X |
Wet processing (thinner foil/stacking accuracy) |
. Super Hi-cap |
X |
O |
Sintering atmosphere Control |
. Better Reliability |
O |
X |
Curing atmosphere Control |
. Better Mechanical and thermal
behavior |
X |
O |
O : Technology development center X
: Member
Latest updated on 16-Sep.-2002, All rights reserved.